000 01466cam a22003374a 4500
001 20092
005 20261006005136.0
008 020215s2002 nyua 000 0 eng
010 _a 2002022737
020 _a0071378820 (alk. paper)
035 _a(DLC) 2002022737
035 _a(DLC)1248
040 _aDLC
_cDLC
_dDLC
042 _apcc
050 0 0 _aTK7870
_b.E4424 2002
082 0 0 _a621.381
_bELE 2002
245 0 0 _aElectronic assembly fabrication :
_bchips, circuit boards, packages, and components /
_cCharles A. Harper, editor-in-chief.
250 _a1st ed.
260 _aNew York :
_bMcGraw-Hill,
_cc2002.
300 _axv, 672 p. :
_bill. ;
_c24 cm.
440 0 _aMcGraw-Hill professional engineering
_921483
440 0 _aElectronic packaging and interconnection series
_921484
650 0 _aElectronic apparatus and appliances
_xDesign and construction.
_921485
700 1 _aHarper, Charles A.
_917629
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/bios/mh041/2002022737.html
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/description/mh024/2002022737.html
856 4 1 _3Table of contents
_uhttp://www.loc.gov/catdir/toc/mh023/2002022737.html
906 _a7
_bcbc
_corignew
_d1
_eocip
_f20
_gy-gencatlg
942 _2ddc
_cOS
999 _c20092
_d20092